|
Project Name
|
High speed micro and nano electronic component connection and testing system that is capable of testing components operating at 50 GHz
|
|
Project Information
|
1. Technology Field
Information Technology, Communications, Digital Technology
|
|
2.Technology brief
100% of all electronic components are tested before assembly. These components are continuing to get smaller and faster and existing technology at the micro and nano scale is limited to 4 to 8 test points and 10 to 12 GHz in speed. This technology can handle thousands of test connections per square cm and transmission speeds up to 40 GHz
|
|
|
3.Description of the technical advantages
The system is extremely fast and can make several hundred thousand connections at one time at the nano scale providing better and faster testing of components. Further the systems can be custom configured to the components being tested further improving throughput.
|
|
|
4.The sustainability of the technical advantages
The need to test electronic components in future assemblies will continue due to the high cost of scrapping complete assemblies. This system is able to test further upstream to identify defective components at the earliest possible level which is also at the most possible cost.
|
|
|
5.Risk of the technology
The risk to this and other technologies is that components are continually getting faster and as a result the technology can not keep pace with the speed of these components. This technology is four times faster than any existing technology on the market and there are ready components above of the speed capability of this technology. There is a possibility of testing the functionality of high-speed components at lower speeds but the ideal scenario would be to test at full throughput capability of these components.
|
|
|
6. The current development situation and progress of the project
This technology has been prototyped and tested and is now ready to be scaled to eight Beta test version for full production volumes.
|
|
|
7. Prospective market value/business value
This technology can be added to the current electronic component test machines to upgrade their value and capacity for wafer level testing and higher volumes of component testing. This technology would be used in the manufacture of components specific test basis that could accommodate hundreds of components on a single multifaceted base at one time. This would dramatically increase the throughput volumes of current test equipment.
|
|
|
8.Intellectual Property
Patent
|
|
|
9.Description of the technical requirements
The recipient of this technology would require full nano fabrication capability to deploy this technology and manufacture the test bases incorporating this technology for the various test machines.
|
|
|
10.Ideal way of cooperation
Technical Transformation
Technology License
Manufacturing Technology; Equipment Transfer
|
|
|
11. Planned Investment Amount
less than $50,000 plus royalties on manufactured bases
|
For more project information, please contact: services@beijing-ontario.org